PCB drilling is the main process stage of FPC forming, and the quality of micropores directly affects the mechanical assembly performance and electrical connection performance of flexible electronic material boards. Moreover, drilling processing accounts for 35% of the entire production time and cost, and has a huge impact on the entire process flow. In the past, PCB circuit board drilling was mainly achieved through mechanical methods. However, with the continuous development of high-density PCBs, a large number of micro hole processing demands have put forward higher requirements for drilling technology. Mechanical drilling technology can no longer meet the market standards of small diameter drilling, high accuracy, and high efficiency, and is gradually being replaced by laser drilling equipment that greatly improves efficiency, flexibility, and quality.